8: CoWoS Supply Chain Capacity Expands Twice, Boosting AI Chip Supply

The wave of AI has led to a surge in server demand, which relies on TSMC's advanced packaging technology CoWoS. Currently, there is still a 20% gap between supply and demand for CoWoS. In addition to NVIDIA, international IC design houses are also increasing their orders. It is estimated that the capacity of CoWoS will increase by 130% by the second half of 2024, and more vendors will actively enter the CoWoS supply chain, which is expected to make the supply of AI chips even more robust in 2024, and will be an important growth booster for the development of AI adoption.

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