6: Growth of China's production capacity and intensified price competition for mature processes

Under the influence of the U.S. ban, China has been actively expanding its production capacity. To maintain its capacity utilization rate, the Chinese industry has continued to offer preferential pricing, which is expected to put pressure on "non-Chinese" foundries. In addition, the inventory of industrial control and automotive IC in the second half of 2023 to the first half of 2024 will have to be de-stocked in the short term, as wafer production is primarily concentrated on mature processes, which will continue to put pressure on suppliers and their ability to regain bargaining power.

7: The CAGR of 2.5/3D Packaging Market is expected to be 22% from 2023 to 2028

As the functionality and performance requirements of semiconductor chips continue to improve, advanced packaging technologies are becoming increasingly important. The 2.5/3D package market is expected to grow at a CAGR of 22% from 2023 to 2028, making it an area of high interest in the semiconductor package testing market.